CAD Designer II : 19-03166

Chandler, AZ 85226

Posted: 07/09/2019 Job Category: Hardware Engineering Job Number: 12399379

Akraya is looking for a CAD Designer II for one of our leading clients. To be considered, please apply directly. To follow up with any questions, please contact Pooja at 408-907-2233.

Akraya is the staffing partner of choice for many leading companies across the US. In fact, we were recently named "Best Staffing Firm to Work For" by Staffing Industry Analysts. We offer comprehensive benefits including Health Insurance (Medical, Dental, and Vision), Cafeteria Plan (HSA, FSA, and dependent care), 401(k) (enrollment subject to eligibility), and Sick Pay (varies based on city and state laws).

If this position is not quite what you're looking for, visit akraya.com and submit a copy of your resume. We will get to work finding you a job that is a better fit at one of our many amazing client

Primary Skills: Mentor Expendition, CAD, NPI, Packaging
Duration: 03+ Months
Contract Type: W2 Only

Responsibilities:
You will work on multiple facets of package substrate layout while collaborating with Design Rule Owners and Electrical Engineers.

Including:
  • Ownership of the layout from feasibility studies to substrate tape-out.
  • Constraint entry of signal integrity guidelines.
  • Placement and routing studies.
  • Package routing studies to optimize new package ball maps.
  • Package substrate modifications to meet assembly and manufacturing design rules
  • Run substrate design reviews with stakeholders.
  • Substrate supplier communication to release the part and its variations for manufacturing.
  • Documentation and release in appropriate archival system.
Top Skill Requirements:
  • 5 or more years of experience with Mentor Xpedition IC Packaging Layout.
  • Package design layout.
  • Familiarity with Valor NPI & ODB++.
  • Familiarity with Mentor Xpedition Package Integrator.

Requirements/skills not limited to the following:
  • 5 or more years of experience with Mentor Xpedition IC Packaging Layout.
  • Experience with different type of substrates such as FCCSP, Organic substrates.
  • Basic knowledge of packaging.
  • Excellent analytical and problem solving skills.
  • Excellent verbal and written communication skills.
  • Familiarity with phases of package design development including: Power Delivery practices, signal integrity practices and theories, constraint entry, library creation, DFM, Design Rule Checks.
  • Minimum educational requirement: AS degree.
Preferred Qualifications:
  • Package design layout.
  • Familiarity with Valor NPI & ODB++.
  • Familiarity with Mentor Xpedition Package Integrator.
  Please apply directly with your updated resume or call Pooja at 408-907-2233

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